Find your space at INTERMOLD, Japan’s top molding exhibition
Organized by the Japan Die & Mold Industry Association, INTERMOLD features everything you need to know about the industry. Expect tech workshops, seminars, business networking with other industry professionals, and keynote speakers to expand your knowledge during the four day event running July 6 to 9.
While you’re there, head over to Booth 3-514, where you’ll find Datadesign. These Artec Ambassadors will be present with some of the best 3D scanning solutions at hand: Artec Leo, our wireless star, Space Spider for high-resolution and unbeatable data capture, and Micro, for the smallest parts that require the most attention to detail.
Find out more here. We’ll see you there!